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TLV2372IDG4 Datasheet(PDF) 9 Page - Texas Instruments |
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TLV2372IDG4 Datasheet(HTML) 9 Page - Texas Instruments |
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9 / 58 page  9 TLV2370, TLV2371, TLV2372 TLV2373, TLV2374, TLV2375 www.ti.com SLOS270F – MARCH 2001 – REVISED AUGUST 2016 Product Folder Links: TLV2370 TLV2371 TLV2372 TLV2373 TLV2374 TLV2375 Submit Documentation Feedback Copyright © 2001–2016, Texas Instruments Incorporated (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.3 Thermal Information: TLV2370 THERMAL METRIC(1) TLV2370 UNIT DBV (SOT-23) D (SOIC) P (PDIP) 6 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 228.5 138.4 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 99.1 89.5 39.4 °C/W RθJB Junction-to-board thermal resistance 54.6 78.6 26.4 °C/W ψJT Junction-to-top characterization parameter 7.7 29.9 15.4 °C/W ψJB Junction-to-board characterization parameter 53.8 78.1 26.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information: TLV2371 THERMAL METRIC(1) TLV2371 UNIT DBV (SOT-23) D (SOIC) P (PDIP) 5 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 228.5 138.4 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 99.1 89.5 39.4 °C/W RθJB Junction-to-board thermal resistance 54.6 78.6 26.4 °C/W ψJT Junction-to-top characterization parameter 7.7 29.9 15.4 °C/W ψJB Junction-to-board characterization parameter 53.8 78.1 26.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.5 Thermal Information: TLV2372 THERMAL METRIC(1) TLV2372 UNIT D (SOIC) DGK (VSSOP) P (PDIP) 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 138.4 191.2 49.2 °C/W RθJC(top) Junction-to-case (top) thermal resistance 89.5 61.9 39.4 °C/W RθJB Junction-to-board thermal resistance 78.6 111.9 26.4 °C/W ψJT Junction-to-top characterization parameter 29.9 5.1 15.4 °C/W ψJB Junction-to-board characterization parameter 78.1 110.2 26.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a °C/W |
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