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VTL5C1 Datasheet(PDF) 72 Page - PerkinElmer Optoelectronics |
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VTL5C1 Datasheet(HTML) 72 Page - PerkinElmer Optoelectronics |
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72 / 76 page  67 Application Notes—Analog Optical Isolators APPLICATION NOTE #2 Handling and Soldering AOIs All opto components must be handled and soldered with care, especially those that use a cast or molded plastic and lead frame construction like the LEDs used in AOIs. In LED lead frame construction, the emitter chip is mounted directly to one lead and a wire bond is made from the chip to the other lead. The encapsulating plastic is the only support for the lead frame. Care must be taken when forming the leads of plastic opto packages. Excessive mechanical force can cause the leads to move inside the plastic package and damage the wire bonds. Weakened bonds can then “open up” under further mechanical or thermal stressing, producing open circuits. In order to form leads safely, it is necessary to firmly lamp the leads near the base of the package in order not to transfer any force (particularly tension forces) to the plastic body. This can be accomplished either through use of properly designed tooling or by firmly gripping the leads below the base of the package with a pair of needle nose pliers while the leads are being bent. Examples of Tooling Fixtures Used to Form Leads For highest reliability, avoid flush mounting the AOI body on the printed circuit board. This minimizes mechanical stress set up between the circuit board and the LED and photocell packages. It also reduces solder head damage to the packages. Good printed circuit board layout avoids putting any spreading (plastic under tension) force on the leads of the LED and photocell. When hand soldering, it is important to limit the maximum temperature of the iron by controlling the power. It is best if a 15W or 25W iron is used. The maximum recommended lead soldering temperature (1/16" from the case for 5 seconds) is 260°C. An RMA rosin core solder is recommended. Sn60 (60% tin / 40% lead) solder is recommended for wave soldering opto components into printed circuit boards. Other alternatives are Sn62 and Sn63. The maximum recommended soldering temperature is 260°C with a maximum duration of 5 seconds. The amount of tarnish on the leads determines the type of flux to use when soldering devices with silver plated leads. Cleaners designed for the removal of tarnish from the leads of electronic components are acidic and it is best to keep the immersion time as short as possible (less than 2 seconds) and to immediately wash all devices thoroughly in ten rinses of deionized water. Condition of Leads Recommended Flux Clear Bright Finish (Tarnish Free) RMA - Mildly Activated Dull Finish (Minimal Tarnish) RMA - Mildly Activated Light Yellow Tint (Mild Tarnish) RA - Activated Light Yellow / Tan Color (Moderate Tarnish) AC - Water Soluble, Organic Acid Flux Dark Tan / Black Color (Heavy Tarnish) Leads Need to be Cleaned Prior to Soldering |
Similar Part No. - VTL5C1 |
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Similar Description - VTL5C1 |
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