1

4

3

2

LMH0395

18

15

16

17

10

7

8

9

21

24

23

22

SDI

5

6

SPI_EN

12

11

13

14

SDO0

19

20

SDI

SDO0

SDO1

SDO1

SS

LMH0395

SNLS323M – AUGUST 2010 – REVISED JULY 2015

www.ti.com

Pin Functions – Pin Mode (Non-SPI) / SPI_EN = GND(1) (continued)

PIN

TYPE

DESCRIPTION

NO.

NAME

Auto Sleep

AUTO SLEEP has precedence over MUTE and BYPASS. This pin has an internal pullup.

19

AUTO SLEEP

I, LVCMOS

H = When no input signal is detected, the device will power down and the outputs will be

in a high impedance state.

L = Device will not enter auto power down.

20

Power

Positive power supply (+2.5 V)

Output mute

CD may be tied to this pin to inhibit the output when no input signal is present. MUTE has

21

MUTE

I, LVCMOS

precedence over BYPASS. This pin has an internal pulldown.

H = Outputs are forced to a constant logic high state.

L = Outputs are enabled.

Carrier detect

22

CD

O, LVCMOS

H = No input signal detected.

L = Input signal detected.

23

Ground

Negative power supply (ground)

24

Power

Positive power supply (+2.5 V)

Connect exposed DAP to negative power supply (ground). See Figure 22 for layout

DAP

Ground

example

RTW Package

24-Pin WQFN SPI Mode

Top View

(1)

PIN

I/O, TYPE

DESCRIPTION

NO.

NAME

1

Ground

Negative power supply (ground)

2

Ground

Negative power supply (ground)

3

SDI

I, Analog

Serial data true input

4

SDI

I, Analog

Serial data complement input

5

Ground

Negative power supply (ground)

(1)

The exposed die attach pad is a negative electrical terminal for this device. It should be connected to the negative power supply voltage.

4

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