5 Vias in between 4 quadrant

Of top solder paste

Ground and V

relief under return loss

CC

Passive components and pads

LMH0395

SNLS323M – AUGUST 2010 – REVISED JULY 2015

www.ti.com

10.2 Layout Examples

Figure 22 and Figure 21 demonstrate the LMH0395EVM PCB layout. Ground and supply relief under the return

loss passive components and pads reduces parasitic - improving return loss performance. The solder mask for

the DAP is divided into four quadrants. Five vias are placed such that they are in the boundary of the 4

quadrants. This is done to ensure vias are not covered by solder mask - improving solerability. This practice

improves both thermal performance and soldering during board assembly.

Figure 21. LMH0395EVM Top Etch Layout Example

Figure 22. LMH0395EVM Top Solder Paste Mask

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