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LMH0302 Datasheet(PDF) 4 Page - Texas Instruments |
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LMH0302 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 18 page 4 LMH0302 SNLS247H – APRIL 2007 – REVISED JUNE 2016 www.ti.com Product Folder Links: LMH0302 Submit Documentation Feedback Copyright © 2007–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage –0.5 3.6 V Input voltage (all inputs) –0.3 VCC + 0.3 V Output current 28 mA Lead temperature, soldering (4 s) 260 °C Junction temperature, TJ 125 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4500 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000 Machine model (MM) ±250 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage (VCC – VEE) 3.13 3.3 3.46 V Operating junction temperature 100 °C Operating free air temperature, TA –40 25 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) LMH0302 UNIT RUM (WQFN) 16 PINS RθJA Junction-to-ambient thermal resistance 47.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 47.2 °C/W RθJB Junction-to-board thermal resistance 25.6 °C/W ψJT Junction-to-top characterization parameter 1.7 °C/W ψJB Junction-to-board characterization parameter 25.7 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 14.5 °C/W (1) Current flow into device pins is defined as positive. Current flow out of device pins is defined as negative. All voltages are stated referenced to VEE = 0 V. (2) Typical values are stated for VCC = 3.3 V and TA = 25°C. 6.5 Electrical Characteristics – DC Over supply voltage and operating free-air temperature range (unless otherwise noted) (1) (2) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VCMIN Input common mode voltage SDI, SDI 1.1 + VSDI/2 VCC – VSDI/2 V VSDI Input voltage swing Differential, SDI, SDI 100 2200 mVP−P |
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