Not to scale

GND

1

SDI

12

SDO

2

SDI

11

SDO

3

VEE

10

SD/HD

4

RREF

9

VCC

3

LMH0302

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SNLS247H – APRIL 2007 – REVISED JUNE 2016

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5 Pin Configuration and Functions

RUM Package

16-Pin WQFN

Top View

(1)

G = Ground, I = Input, O = Output, and P = Power

Pin Functions

PIN

DESCRIPTION

NAME

NO.

ENABLE

6

I

Output driver enable. When low, the SDO/SDO output driver is powered off. ENABLE has an

internal pullup. H = Normal operation. L = Output driver powered off.

EP

—

G

EP is the exposed pad at the bottom of the WQFN package. The exposed pad must be

connected to the ground plane through a via array. See Figure 6 for details.

NC

5, 7, 8, 13,

14, 15, 16

—

No connect. Not bonded internally.

4

I

SD/HD

10

I

Output slew rate control. Output rise/fall time complies with ST 424 or 292 when low and ST 259

when high.

SDI

1

I

Serial data true input.

SDI

2

I

Serial data complement input.

SDO

12

O

Serial data true output.

SDO

11

O

Serial data complement output.

9

P

Positive power supply (3.3 V).

3

G

Negative power supply (ground).