LM57-Q1

SNIS191A – JULY 2015 – REVISED JULY 2015

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6.4 Thermal Information

LM57-Q1

PW (TSSOP)

UNIT

8 PINS

Junction-to-ambient thermal resistance

183

°C/W

Junction-to-case (top) thermal resistance

66

°C/W

Junction-to-board thermal resistance

111

°C/W

Junction-to-top characterization parameter

8

°C/W

Junction-to-board characterization parameter

110

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

not include DC load regulation. These stated accuracy limits are with reference to the values in Table 1.

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

TRIP POINT ACCURACY FOR ALL LM57-Q1 EXCEPT LM57FSPWQ1 AND LM57TSPWQ1

J2

±2.3

°C

52°C

V

J3

±2.3

°C

97°C

V

Trip Point Accuracy

(Includes 1% set-resistor

J4

±2.3

°C

tolerance)

119°C

V

J5

free air

±2.3

°C

V

temperature max

TRIP POINT ACCURACY FOR LM57-Q1 AUTOMOTIVE GRADE 0 EXTENDED (LM57FSPWQ1 and LM57TSPWQ1)

J2

52°C

J3

97°C

±2.3

Trip point accuracy

V

(Includes 1% set-resistor

J4

°C

119°C

tolerance)

J5

160°C

J5

±2.5

160°C

V

6

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