5

LM2590HV

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SNVS084C – DECEMBER 2001 – REVISED JULY 2016

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Copyright © 2001–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Voltage internally clamped. If clamp voltage is exceeded, limit current to a maximum of 1 mA.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

63

V

6

V

1.5

V

Flag pin voltage

–0.3

45

V

Feedback pin voltage

–0.3

25

V

Output voltage to ground, steady-state

–1

V

Power dissipation

Internally limited

Lead temperature

S package

Vapor phase (60 s)

215

°C

Infrared (10 s)

245

T package, soldering (10 s)

260

Maximum junction temperature

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

4.5

60

V

Temperature

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

(2)

Junction to ambient thermal resistance (no external heat sink) for the package mounted TO-220 package mounted vertically, with the

(3)

(1 oz.) copper area.

(4)

(1 oz.) copper area.

(5)

Junction to ambient thermal resistance with the TO-263 package tab soldered to a double sided printed circuit board with 3 in 2 of

Application Information in this data sheet.

6.4 Thermal Information

LM2590HV

UNIT

NDZ (TO-220)

KTW (TO-263)

7 PINS

7 PINS

Junction-to-ambient thermal resistance

50

—

°C/W

—

50

—

30

—

20

Junction-to-case thermal resistance

2

2

°C/W