ExposedPad

1

VA

10

SCLK

2

VOUTA

9

SYNC

3

VOUTB

8

DIN

4

VOUTC

7

VREFIN

5

VOUTD

6

GND

1

VA

10

SCLK

2

VOUTA

9

SYNC

3

VOUTB

8

DIN

4

VOUTC

7

VREFIN

5

VOUTD

6

GND

3

DAC124S085

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SNAS348G – MAY 2006 – REVISED APRIL 2016

Product Folder Links: DAC124S085

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5 Description (continued)

A power-on reset circuit ensures that the DAC output powers up to zero volts and remains there until there is a

valid write to the device. A power-down feature reduces power consumption to less than a microWatt with three

different termination options.

The low power consumption and small packages of the DAC124S085 make it an excellent choice for use in

battery-operated equipment.

The DAC124S085 is one of a family of pin-compatible DACs, including the 8-bit DAC084S085 and the 10-bit

DAC104S085. The DAC124S085 operates over the extended industrial temperature range of

−40°C to 105°C.

6 Pin Configuration and Functions

DGS Package

10-Pin VSSOP

Top View

DSC Package

10-Pin WSON

Top View

(1)

G = Ground, I = Input, O = Output, and S = Supply

Pin Functions

PIN

DESCRIPTION

NO.

NAME

1

S

Power supply input. Must be decoupled to GND.

2

O

Channel A analog output voltage.

3

O

Channel B analog output voltage.

4

O

Channel C analog output voltage.

5

O

Channel D analog output voltage.

6

GND

G

Ground reference for all on-chip circuitry.

7

I

Unbuffered reference voltage shared by all channels. Must be decoupled to GND.

8

I

Serial data input. Data is clocked into the 16-bit shift register on the falling edges of SCLK after the

fall of SYNC.

9

SYNC

I

Frame synchronization input for the data input. When this pin goes low, it enables the input shift

register and data is transferred on the falling edges of SCLK. The DAC is updated on the 16th clock

cycle unless SYNC is brought high before the 16th clock, in which case the rising edge of SYNC

acts as an interrupt and the write sequence is ignored by the DAC.

10

SCLK

I

Serial clock input. Data is clocked into the input shift register on the falling edges of this pin.

11

PAD

(WSON only)

G

Exposed die attach pad can be connected to ground or left floating. Soldering the pad to the PCB

offers optimal thermal performance and enhances package self-alignment during reflow.