5

DAC124S085

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SNAS348G – MAY 2006 – REVISED APRIL 2016

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

DAC124S085

UNIT

DGS (VSSOP)

DSC (WSON)

10 PINS

10 PINS

Junction-to-ambient thermal resistance

240

250

°C/W

Junction-to-case (top) thermal resistance

53.3

40.7

°C/W

Junction-to-board thermal resistance

78.9

23.7

°C/W

Junction-to-top characterization parameter

4.8

0.4

°C/W

Junction-to-board characterization parameter

77.6

23.8

°C/W

Junction-to-case (bottom) thermal resistance

—

4.7

°C/W

(1)

Quality Level).

(2)

This parameter is ensured by design and/or characterization and is not tested in production.

7.5 Electrical Characteristics

otherwise noted).

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

STATIC PERFORMANCE

Resolution

–40°C

12

Bits

Monotonicity

–40°C

12

Bits

INL

Integral non-linearity

±2.4

LSB

–40°C

±8

DNL

Differential non-linearity

±0.2

LSB

–40°C

–0.5

0.7

(2)

±0.15

LSB

–40°C

±0.5

ZE

Zero code error

4

mV

–40°C

15

FSE

Full-scale error

–0.1%

FSR

–40°C

–0.75%

GE

Gain error

All ones loaded

to DAC register

–0.2%

FSR

–40°C

–1%

ZCED

Zero code error drift

–20

µV/°C

TC GE

Gain error tempco

–0.7

ppm/°C

–1

ppm/°C

OUTPUT CHARACTERISTICS

–40°C

0

V

High-impedance output

–40°C

±1

µA

ZCO

Zero code output

1.3

mV

6

mV

7

mV

10

mV

FSO

Full-scale output

2.984

V

2.934

V

4.989

V

4.958

V