ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

bq24705

Table 1. TERMINAL FUNCTIONS – 24-PIN QFN (continued)

TERMINAL

DESCRIPTION

NAME

NO.

Exposed pad beneath the IC. AGND and PGND star-connected only at the PowerPad plane. Always solder

PowerPad™

PowerPad to the board, and have vias on the PowerPad plane connecting to AGND and PGND planes . It also

serves as a thermal pad to dissipate the heat.

over operating free-air temperature range (unless otherwise noted)

(1) (2)

VALUE

UNIT

PVCC, ACP, ACN, SRP, SRN, BAT

–0.3 to 30

PH

–1 to 30

REGN, LODRV, VADJ, ACSET, SRSET, ACDET, ISYNSET, CHGEN,

Voltage range

–0.3 to 7

V

CELLS, ACGOOD, DPMDET, IADAPT

VREF

–0.3 to 3.6

BTST, HIDRV with respect to AGND and PGND

–0.3 to 36

Maximum difference voltage

ACP–ACN, SRP–SRN, AGND–PGND

–0.5 to 0.5

V

Junction temperature range

–40 to 155

°C

Storage temperature range

–55 to 155

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to GND if not specified. Currents are positive into, negative out of the specified terminal. Consult Packaging

Section of the data book for thermal limitations and considerations of packages.

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

PH

–1

24

PVCC, ACP, ACN, SRP, SRN, BAT

0

24

REGN, LODRV, VADJ

0

6.5

VREF

0

3.3

Voltage range

V

ACSET, SRSET, ACDET, ISYNSET, CHGEN, CELLS, ACGOOD, DPMDET,

0

5.5

IADAPT

BTST, HIDRV with respect to AGND and PGND

0

30

AGND, PGND

–0.3

0.3

Maximum difference voltage: ACP–ACN, SRP–SRN

–0.3

0.3

V

Junction temperature range

–40

125

°C

Storage temperature range

–55

150

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