VREF

100 kΩ

R11

66.5 kΩ

R12

100 kΩ

R13

42 kΩ

R14

VREF

R

AC

0.01 Ω

Q1 (ACFET)

SI4435

Q3(BATFET)

SI4435

Controlled by

HOST

P

P

ACN

ACP

ACDET

ACGOOD

SRSET

ACSET

VREF

GPIO

CELLS

CHGEN

VADJ

ADC

IADAPT

HOST

PVCC

HIDRV

PH

BTST

REGN

LODRV

PGND

SRP

SRN

P

PACK+

PACK–

SYSTEM

ADAPTER +

ADAPTER–

ACGOOD

AGND

bq24705

432 kΩ

1%

66.5 kΩ

1%

R1

R2

R3

C4

C2

C5

C8

Q4

FDS6680A

C9

D1

BAT54

C10

BAT

ISYNSET

R6

30 kΩ

DPMDET

R4

Q2 (ACFET)

SI4435

Controlled by

HOST

C6

C15

0.1 µF

C1

2 Ω

R10

2.2 µF

0.1 µF

1 µF

10 kΩ

10kΩ

100 pF

C14

0.1 µF

0.1 µF

1 µF

R

SR

0.01 Ω

0.1 µF

10 µF

C7

10 µF

C12

10 µF

PowerPad

REGN

D2

BAT54

Q5

FDS6680A

L1

4.7 µH

C3

0.1µF

C13

0.1 µF

C11

10 µF

PACKAGE THERMAL DATA

bq24705

(1)

Pull-up rail could be either VREF or other system rail.

(2)

SRSET/ACSET could come from either DAC or resistor dividers.

(3)

Figure 3. Typical System Schematic, Voltage and Current Programmed by Resistor

ORDERING INFORMATION

Ordering Number

Part Number

Package

Quantity

(Tape and Reel)

bq24705RGER

3000

bq24705

24-PIN 4 x 4 mm QFN

bq24705RGET

250

DERATING FACTOR ABOVE

PACKAGE

θ

JA

45°C/W

2.33 W

0.023 W/°C

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

Web site at www.ti.com.

(2)

This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is

connected to the ground plane by a 2x3 via matrix.

Copyright © 2007–2009, Texas Instruments Incorporated

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