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ADC12J1600 Datasheet(PDF) 15 Page - Texas Instruments

Part # ADC12J1600
Description  GSPS ADCs With Integrated DDC
Download  98 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

ADC12J1600 Datasheet(HTML) 15 Page - Texas Instruments

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ADC12J1600, ADC12J2700
www.ti.com
SLAS969C – JANUARY 2014 – REVISED JULY 2015
Electrical Characteristics (continued)
Unless otherwise noted, these specifications apply for V(VA12) = V(VD12) = 1.2 V, V(VA19) = 1.9 V, VIN full scale range at default
setting (725 mVPP), VIN = –1 dBFS, differential AC-coupled sinewave input clock, ƒ(DEVCLK) = 2.7 or 1.6 GHz at 0.5 VPP with
50% duty cycle, R(RBIAS) = 3.3 kΩ ±0.1%, after a foreground (FG) mode calibration with timing calibration enabled. Typical
values are at TA = 25°C.
(1)(2)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
TEMPERATURE DIODE CHARACTERISTICS
Offset voltage (approx. 0.77 V) varies with
100-µA forward current
–1.6
mV/°C
process and must be measured for each
Device active
Temperature diode voltage
V(TDIODE)
part. Offset measurement should be done
slope
100-µA forward current
with PowerDown=1 to minimize device self-
–1.6
mV/°C
Device in power-down
heating.
CLOCK INPUT CHARACTERISTICS (DEVCLK±, SYSREF±, SYNC~/TMST±)
Sine wave clock, TA = TMIN to TMAX
0.4
0.6
2
VPP
VID(CLK)
Differential clock input level
Square wave clock, TA = TMIN to TMAX
0.4
0.6
2
VPP
II(CLK)
Input current
VI = 0 or VI = VA
±1
µA
Differential
0.02
pF
CI(CLK)
Input capacitance
(4)
Each input to ground
1
pF
TA = 25°C
95
Ω
RID(CLK)
Differential input resistance
TA = TMIN to TMAX
80
110
Ω
CML OUTPUT CHARACTERISTICS (DS0–DS7±)
Assumes ideal 100-
Ω load
VOD
Differential output voltage
Measured differentially
280
305
330
mV peak
Default pre-emphasis setting
VO(ofs)
Output offset voltage
0.6
V
Output+ and output– shorted together
±6
IOS
Output short-circuit current
mA
Output+ or output– shorted to 0 V
12
ZOD
Differential output impedance
100
Ω
LVCMOS INPUT CHARACTERISTICS (SDI, SCLK, SCS, SYNC~)
VIH
Logic high input voltage
See
(5)
0.83
V
VIL
Logic low input voltage
See
(5)
0.4
V
CI
Input capacitance
(4) (6)
Each input to ground
1
pF
LVCMOS OUTPUT CHARACTERISTICS (SDO, OR_T0, OR_T1)
VOH
CMOS H level output
IOH = –400 µA
(5)
1.65
1.9
V
VOL
CMOS L level output
IOH = 400 µA
(5)
0.01
0.15
V
POWER SUPPLY CHARACTERISTICS
ADC12J2700, ƒ(DEVCLK) = 2.7 GHz
PD = 0, calibration = FG, bypass DDC
457
495
I(VA19)
Analog 1.9-V supply current
PD = 0, calibration = BG, bypass DDC
557
594
mA
PD = 0, calibration = BG, decimate by 8, DDR = 0, P54 = 1
557
598
PD = 0, calibration = FG, bypass DDC
245
296
I(VA12)
Analog 1.2-V supply current
PD = 0, calibration = BG, bypass DDC
261
312
mA
PD = 0, calibration = BG, decimate by 8, DDR = 0, P54 = 1
270
322
PD = 0, calibration = FG, bypass DDC
330
541
I(VD12)
Digital 1.2-V supply current
PD = 0, calibration = BG, bypass DDC
341
588
mA
PD = 0, calibration = BG, decimate by 8, DDR = 0, P54 = 1
366
610
PD = 0, calibration = FG, bypass DDC
1.56
1.94
PD = 0, calibration = BG, bypass DDC
1.78
2.21
W
PC
Power consumption
PD = 0, calibration = BG, decimate by 8, DDR = 0, P54 = 1
1.82
2.25
PD = 1
< 50
mW
(6)
The digital control pin capacitances are die capacitances only and is in addition to package and bond-wire capacitance of approximately
0.4 pF.
Copyright © 2014–2015, Texas Instruments Incorporated
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