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ADC12J1600 Datasheet(PDF) 95 Page - Texas Instruments |
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ADC12J1600 Datasheet(HTML) 95 Page - Texas Instruments |
95 / 98 page ![]() www.ti.com PACKAGE OUTLINE C PIN 1 ID 0.9 MAX 0.05 0.00 4X 8 68X 0.3 0.2 64X 0.5 68X 0.7 0.5 4X (45 X0.42) 7.7 0.1 B 10.1 9.9 A 10.1 9.9 (0.2) VQFN - 0.9 mm max height NKE0068A PLASTIC QUAD FLATPACK - NO LEAD 4214820/A 12/2014 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. 51 35 34 18 17 1 68 52 0.1 C A B 0.05 C PIN 1 ID (OPTIONAL) SYMM SYMM 0.1 C SEATING PLANE SCALE 1.700 |
Similar Part No. - ADC12J1600_16 |
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Similar Description - ADC12J1600_16 |
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