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ADC12J1600 Datasheet(PDF) 90 Page - Texas Instruments |
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ADC12J1600 Datasheet(HTML) 90 Page - Texas Instruments |
90 / 98 page ![]() ADC12J1600, ADC12J2700 SLAS969C – JANUARY 2014 – REVISED JULY 2015 www.ti.com 10.3 Thermal Management The ADC12J1600 and ADC12J2700 devices are capable of impressive speeds and performance at low power levels for speed. However, the power consumption is still high enough to require attention to thermal management. The VQFN package has a primary-heat transfer path through the center pad on the bottom of the package. The thermal resistance of this path is provided as RθJCbot. For reliability reasons, the die temperature must be kept to a maximum of 135°C which is the ambient temperature (TA) plus the ADC power consumption multiplied by the net junction-to-ambient thermal resistance (RθJA). Maintaining this temperature is not a problem if the ambient temperature is kept to a maximum of 85°C as specified in the Recommended Operating Conditions table and the center ground pad on the bottom of the package is thermally connected to a large-enough copper area of the PC board. The package of the ADC12J1600 and ADC12J2700 devices have a center pad that provides the primary heat- removal path as well as excellent electrical grounding to the PCB. Recommended land pattern and solder paste examples are provided in the Mechanical, Packaging, and Orderable Information section. The center-pad vias shown must be connected to internal ground planes to remove the maximum amount of heat from the package, as well as to ensure best product parametric performance. If needed to further reduce junction temperature, TI recommends to build a simple heat sink into the PCB which occurs by including a copper area of about 1 to 2 cm2 on the opposite side of the PCB. This copper area can be plated or solder-coated to prevent corrosion, but should not have a conformal coating which would provide thermal insulation. Thermal vias will be used to connect these top and bottom copper areas and internal ground planes. These thermal vias act as heat pipes to carry the thermal energy from the device side of the board to the opposite side of the board where the heat can be more effectively dissipated. 11 Device and Documentation Support 11.1 Device Support 11.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 11.1.2 Development Support For the ADC Harmonic Calculator, got to http://www.ti.com/tool/adc-harmonic-calc. 11.1.3 Device Nomenclature Aperture (sampling) Delay is the amount of delay, measured from the sampling edge of the clock input, after which the signal present at the input pin is sampled inside the device. Aperture Jitter (t(AJ)) is the variation in aperture delay from sample to sample. Aperture jitter appears as input noise. Clock Duty Cycle is the ratio of the time that the clock waveform is at a logic high to the total time of one clock period. Full Power Bandwidth (FPBW) is a measure of the frequency at which the reconstructed output fundamental drops 3 dB below the low frequency value for a full scale input. Interleaving Spurs are frequency domain (FFT) artifacts resulting from non-idealities in the multi-bank interleaved architecture of the ADC. Offset errors between banks result in fixed spurs at ƒS / 4 and ƒS / 2. Gain and timing errors result in input-signal-dependent spurs at ƒS / 4 ± FIN and ƒS / 2 ± FIN. Intermodulation Distortion (IMD) is the creation of additional spectral components as a result of two sinusoidal frequencies being applied to the ADC input at the same time. IMD is defined as the ratio of the power in the second-order and third-order intermodulation products to the power in one of the original frequencies. IMD is usually expressed in dBFS. 90 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: ADC12J1600 ADC12J2700 |
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