TPS61000, TPS61001, TPS61002, TPS61003

TPS61004, TPS61005, TPS61006, TPS61007

SLVS279D – MARCH 2000 – REVISED AUGUST 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

–0.3

3.6

V

Input voltage (SW)

–0.3

V

Peak current into SW

1300

mA

Continuous total power dissipation

See Thermal Information

Operating free-air temperature

–40

85

°C

Maximum junction temperature

150

°C

Lead temperature

260

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±1000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

0.8

V

100

Output current

mA

250

Inductor

10

33

µH

Input capacitor

10

µF

Output capacitor

22

µF

Operating junction temperature

–40

125

°C

7.4 Thermal Information

TPS6100x

DGS (VSSOP)

UNIT

10 PINS

Junction-to-ambient thermal resistance

160.6

°C/W

Junction-to-case (top) thermal resistance

54.4

°C/W

Junction-to-board thermal resistance

80.5

°C/W

Junction-to-top characterization parameter

6.3

°C/W

Junction-to-board characterization parameter

79.2

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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