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TPS65010RGZT Datasheet(PDF) 53 Page - Texas Instruments

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Part # TPS65010RGZT
Description  Power and Battery Management IC for Li-Ion Powered Systems
Download  63 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPS65010RGZT Datasheet(HTML) 53 Page - Texas Instruments

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TPS65010
www.ti.com
SLVS149C – JUNE 2003 – REVISED SEPTEMBER 2015
9 Power Supply Recommendations
9.1 LDO1 Output Voltage Adjustment
The output voltage of LDO1 is set with a resistor divider at the feedback pin. The sum of the two resistors must
not exceed 1 M
Ω to minimize voltage changes due to leakage current into the feedback pin. The output voltage
for LDO1 after start up is the voltage set by the external resistor divider. It can be reprogrammed with the I2C
interface to the three other values defined in the register VREGS1.
10 Layout
10.1 Layout Guidelines
The input capacitors for the DC-DC converters must be placed as close as possible to the VINMAIN, VINCORE,
and VCC pins.
The inductor of the output filter must be placed as close as possible to the device to provide the shortest
switch node possible, reducing the noise emitted into the system and increasing the efficiency.
Sense the feedback voltage from the output at the output capacitors to ensure the best DC accuracy.
Feedback must be routed away from noisy sources such as the inductor. If possible, route on the opposite
side from the switch node and inductor. Use a GND plane or keep out region to isolate the feedback trace
from noisy sources.
Place the output capacitors as close as possible to the inductor to reduce the feedback loop. This will ensure
best regulation at the feedback point.
Place the device as close as possible to the most demanding or sensitive load. The output capacitors must
be placed close to the input of the load. This will ensure the best AC performance possible.
The input and output capacitors for the LDOs must be placed close to the device for best regulation
performance.
Use vias to connect thermal pad to ground plane.
TI recommends using the common ground plane for the layout of this device. The AGND can be separated
from the PGND, but a large low parasitic PGND is required to connect the PGNDx pins to the CIN and
external PGND connections. If the AGND and PGND planes are separated, have one connection point to
reference the grounds together. Place this connection point close to the IC.
Copyright © 2003–2015, Texas Instruments Incorporated
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