TPS61193-Q1

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SNVSAC7 – OCTOBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN, SW, FB

–0.3

50

Voltage on pins

OUT1, OUT2, OUT3

–0.3

45

V

LDO, SYNC, FSET, ISET, PWM, VDDIO/EN, FAULT

–0.3

5.5

Internally Limited

(4)

–40

125

(4)

–40

150

ºC

Maximum lead temperature (soldering)

–65

150

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

(4)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

(5)

For detailed soldering specifications and information, please refer to the PowerPAD™ Thermally Enhanced Package Application Note

(SLMA002).

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

All other pins

±500

V

Charged-device model (CDM), per AEC Q100-

011

Corner pins (1,10,11,20)

±750

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

4.5

45

SW

0

45

Voltage on pins

OUT1, OUT2, OUT3

0

40

V

FB, FSET, LDO, ISET, VDDIO/EN, FAULT

0

5.25

SYNC, PWM

0 VDDIO/EN

(1)

All voltages are with respect to the potential at the GND pins.

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