TPS61193-Q1

SNVSAC7 – OCTOBER 2015

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11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation see the following:

•

Using the TPS61193EVM and TPS61193-Q1EVM Evaluation Module (SNVU491)

•

PowerPAD™ Thermally Enhanced Package Application Note (SLMA002)

•

Texas Instruments Application Report Understanding Boost Power Stages in Switch Mode Power Supplies

(SLVA061

•

Texas Instruments Analog Applications Journal Designing DC/DC Converters Based on SEPIC Topology

(SLYT309)

•

Power Stage Designer™ Tool can be used for both boost and SEPIC: http://www.ti.com/tool/powerstage-

designer

11.2 Trademarks

11.3 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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