LP8862-Q1

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SNVSA75A – NOVEMBER 2015 – REVISED NOVEMBER 2015

6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN, VSENSE_N, SD, SW, FB

–0.3

50

Voltage on pins

OUT1, OUT2

–0.3

45

V

LDO, SYNC, FSET, ISET, PWM, VDDIO/EN, FAULT

–0.3

5.5

Internally Limited

(4)

–40

125

ºC

(4)

–40

150

ºC

Maximum lead temperature (soldering)

ºC

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to the potential at the GND pins.

(3)

(4)

In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may

(5)

For detailed soldering specifications and information, please refer to the PowerPAD™ Thermally Enhanced Package Application Note

(SLMA002).

6.2 ESD Ratings

VALUE

UNIT

±2000

Corner pins (1, 10, 11,

Electrostatic discharge

±750

V

Charged-device model (CDM), per AEC

20)

Q100-011

Other pins

±500

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN

4.5

45

VSENSE_N, SD, SW

0

45

Voltage on pins

OUT1, OUT2

0

40

V

FB, FSET, LDO, ISET, VDDIO/EN, FAULT

0

5.25

SYNC, PWM

0

VDDIO/EN

(1)

All voltages are with respect to the potential at the GND pins.

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5

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