LP8862-Q1

SNVSA75A – NOVEMBER 2015 – REVISED NOVEMBER 2015

www.ti.com

11 Device and Documentation Support

11.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT

CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES

OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER

ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation see the following:

•

Using the LP8862-Q1EVM Evaluation Module (SNVU478)

•

PowerPAD™ Thermally Enhanced Package Application Note (SLMA002)

•

Texas Instruments Application Report Understanding Boost Power Stages in Switch Mode Power Supplies

(SLVA061

•

Texas Instruments Analog Applications Journal Designing DC/DC Converters Based on SEPIC Topology

(SLYT309)

•

Power Stage Designer™ Tool can be used for both boost and SEPIC: http://www.ti.com/tool/powerstage-

designer

11.3 Trademarks

All trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

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