TPS40322

SLUSAF8E – JULY 2011 – REVISED JANUARY 2016

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6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range, all voltages are with respect to GND (unless otherwise noted)

(1)

MIN

MAX

UNIT

VDD

–0.3

22

SW1, SW2

–3

27

SW1, SW2 (< 100-ns pulse width)

–5

SW1, SW2 (< 10-ns pulse width)

–7.5

30

BOOT1, BOOT2

–0.3

30

Voltage

V

BOOT1, BOOT2 (< 10-ns pulse width)

–0.5

33

BP6

–0.3

7

HDRV1, HDRV2

–2

30

BOOT1-SW1, BOOT2-SW2, HDRV1-SW1, HDRV2-SW2

–0.3

7

(differential from BOOT or HDRV to SW)

All other pins

–0.3

7

–40

145

Temperature

°C

–55

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

Input operating voltage

3

20

V

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TPS40322

RHB (VQFN)

UNIT

32 PINS

Junction-to-ambient thermal resistance

37.1

°C/W

Junction-to-case (top) thermal resistance

28.4

°C/W

Junction-to-board thermal resistance

9.8

°C/W

Junction-to-top characterization parameter

0.4

°C/W

Junction-to-board characterization parameter

9.7

°C/W

Junction-to-case (bottom) thermal resistance

2.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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