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EXAMPLE BOARD LAYOUT

0.07 MIN

ALL AROUND

0.07 MAX

ALL AROUND

8X (0.3)

(2.4)

(2.8)

6X (0.65)

(1.6)

(

) VIA

TYP

0.2

(0.55)

(0.95)

8X (0.6)

(R

) TYP

0.05

VSON - 1 mm max height

DRB0008F

PLASTIC SMALL OUTLINE - NO LEAD

4222121/A 11/2015

SYMM

1

4

5

8

SCALE:20X

LAND PATTERN EXAMPLE

NOTES: (continued)

4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature

number SLUA271 (www.ti.com/lit/slua271).

5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.

SOLDER MASK

OPENING

SOLDER MASK

METAL UNDER

SOLDER MASK

DEFINED

METAL

SOLDER MASK

OPENING

NON SOLDER MASK

SOLDER MASK DETAILS

DEFINED

(PREFERRED)

18

bq29200, bq29209

SLUSA52C – SEPTEMBER 2010 – REVISED MARCH 2016

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Product Folder Links: bq29200 bq29209

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