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PACKAGE OUTLINE

C

A

A

8X

0.35

0.25

2.4±0.1

2X

1.95

1.6±0.1

6X 0.65

1 MAX

8X

0.5

0.3

0.05

0.00

A

3.1

2.9

B

3.1

2.9

(0.2) TYP

(0.08)

(0.05)

VSON - 1 mm max height

DRB0008F

PLASTIC SMALL OUTLINE - NO LEAD

4222121/A 11/2015

PIN 1 INDEX AREA

SEATING PLANE

0.08 C

1

4

5

8

(OPTIONAL)

PIN 1 ID

0.1

C A

B

0.05

C

THERMAL PAD

EXPOSED

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.

SCALE 4.000

SCALE 30.000

SECTION A-A

SECTION A-A

TYPICAL

17

bq29200, bq29209

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SLUSA52C – SEPTEMBER 2010 – REVISED MARCH 2016

Product Folder Links: bq29200 bq29209

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