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bq27320

SLUSCG9A – FEBRUARY 2016 – REVISED MARCH 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Condition not to exceed 100 hours at 25°C lifetime.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Regulator input range

–0.3

5.5

V

–0.3

V

CE input pin

–0.3

V

Supply voltage range

–0.3

2.75

V

Open-drain I/O pins (SDA, SCL, SOC_INT)

–0.3

5.5

V

BAT input pin

–0.3

5.5

V

–0.3

V

Input voltage range to all other pins

(BI/TOUT, TS, SRP, SRN, SDQ, BAT_GD)

–0.3

V

Operating free-air temperature range

–40

85

°C

Functional Temperature

–40

110

°C

Storage temperature range

–65

150

°C

(1)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic Discharge

1500

V

Human-body model (HBM), all other pins

2000

500

V

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

No operating restrictions

2.8

4.5

V

No FLASH writes

2.45

2.8

External input capacitor for internal

Nominal capacitor values specified.

Recommend a 5% ceramic X5R type

capacitor located close to the device.

0.1

μF

External output capacitor for internal

0.47

1

μF

Power-up communication delay

250

ms

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953

7.4 Thermal Information

bq27320

UNIT

YZF (DSBGA)

15 PINS

Junction-to-ambient thermal resistance

70

°C/W

Junction-to-case (top) thermal resistance

17

°C/W

Junction-to-board thermal resistance

20

°C/W

Junction-to-top characterization parameter

1

°C/W

Junction-to-board characterization parameter

18

°C/W

Junction-to-case (bottom) thermal resistance

n/a

°C/W