www.ti.com

EXAMPLE BOARD LAYOUT

42X (

)

0.23

(0.4) TYP

(0.4) TYP

(

)

METAL

0.23

0.05 MAX

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

(

)

SOLDER MASK

OPENING

0.23

0.05 MIN

4222067/A 05/2015

DSBGA - 0.625 mm max height

YFF0042

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).

SOLDER MASK DETAILS

NOT TO SCALE

SYMM

SYMM

LAND PATTERN EXAMPLE

SCALE:25X

A

B

C

D

1

2

3

4

5

E

F

G

6

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK

DEFINED