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MAX14850 Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX14850 Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 17 page MAX14850 Six-Channel Digital Isolator 2 Maxim Integrated VCCA to GNDA ........................................................-0.3V to +6V VCCB to GNDB ........................................................-0.3V to +6V OUTA1, OUTA2 to GNDA ..................... -0.3V to (VCCA + 0.3V) OUTB1, OUTB2 to GNDB ..................... -0.3V to (VCCB + 0.3V) INB1, INB2, I/OA1, I/OA2 to GNDA ........................-0.3V to +6V INA1, INA2, I/OB1, I/OB2 to GNDB ........................-0.3V to +6V Short-Circuit Duration (OUTA_ to GNDA or VCCA, OUTB_ to GNDB or VCCB) .........................Continuous Continuous Current (I/OA_, I/OB_) Pin............................ Q50mA Continuous Power Dissipation (TA = +70NC) SOIC (derate 13.3mW/NC above +70NC)..............1067mW QSOP (derate 9.6mW/NC above +70NC)..............771.5mW Operating Temperature Range........................ -40NC to +125NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+260NC Absolute Maximum Ratings Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. SOIC Junction-to-Ambient Thermal Resistance (BJA) ..........75NC/W Junction-to-Case Thermal Resistance (BJC) ...............24NC/W QSOP Junction-to-Ambient Thermal Resistance (BJA) .....103.7NC/W Junction-to-Case Thermal Resistance (BJC) ...............37NC/W Package Thermal Characteristics (Note 1) Electrical Characteristics (VCCA - VGNDA = 3.0V to 5.5V, VCCB - VGNDB = 3.0V to 5.5V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at VCCA - VGNDA = 3.3V, VCCB - VGNDB = 3.3V, and TA = +25°C.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNIT DC CHARACTERISTICS Supply Voltage VCCA Relative to GNDA 3.0 5.5 V VCCB Relative to GNDB 3.0 5.5 Supply Current ICCA, ICCB Unidirectional inputs at DC or 2Mbps; bidirectional inputs at DC or switching at 2Mbps, no load VCCA = +5V, VCCB = +5V 7.2 11 mA VCCA = +3.3V, VCCB = +3.3V 6.2 9.5 All inputs switching at max data rate. No load. (Note 3) VCCA = +5V, VCCB = +5V TA = +25°C 15 22 TA = +125°C 17 24 VCCA = +3.3V, VCCB = +3.3V TA = +25°C 10 16 TA = +125°C 11 18 Undervoltage-Lockout Threshold VUVLO VCCA - VGNDA, VCCB - VGNDB (Note 4) 2 V Undervoltage-Lockout Hysteresis VUVLOHYS VCCA - VGNDA, VCCB - VGNDB (Note 4) 0.1 V |
Similar Part No. - MAX14850_14 |
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Similar Description - MAX14850_14 |
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