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MAX14850 Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX14850
Description  Six-Channel Digital Isolator
Download  17 Pages
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX14850 Datasheet(HTML) 2 Page - Maxim Integrated Products

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MAX14850
Six-Channel Digital Isolator
2
Maxim Integrated
VCCA to GNDA ........................................................-0.3V to +6V
VCCB to GNDB ........................................................-0.3V to +6V
OUTA1, OUTA2 to GNDA ..................... -0.3V to (VCCA + 0.3V)
OUTB1, OUTB2 to GNDB ..................... -0.3V to (VCCB + 0.3V)
INB1, INB2, I/OA1, I/OA2 to GNDA ........................-0.3V to +6V
INA1, INA2, I/OB1, I/OB2 to GNDB ........................-0.3V to +6V
Short-Circuit Duration (OUTA_ to GNDA or
VCCA, OUTB_ to GNDB or VCCB) .........................Continuous
Continuous Current (I/OA_, I/OB_) Pin............................ Q50mA
Continuous Power Dissipation (TA = +70NC)
SOIC (derate 13.3mW/NC above +70NC)..............1067mW
QSOP (derate 9.6mW/NC above +70NC)..............771.5mW
Operating Temperature Range........................ -40NC to +125NC
Junction Temperature .....................................................+150NC
Storage Temperature Range............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) ......................................+260NC
Absolute Maximum Ratings
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to
www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SOIC
Junction-to-Ambient Thermal Resistance (BJA) ..........75NC/W
Junction-to-Case Thermal Resistance (BJC) ...............24NC/W
QSOP
Junction-to-Ambient Thermal Resistance (BJA) .....103.7NC/W
Junction-to-Case Thermal Resistance (BJC) ...............37NC/W
Package Thermal Characteristics
(Note 1)
Electrical Characteristics
(VCCA - VGNDA = 3.0V to 5.5V, VCCB - VGNDB = 3.0V to 5.5V, TA = -40°C to +125°C, unless otherwise noted. Typical values are at
VCCA - VGNDA = 3.3V, VCCB - VGNDB = 3.3V, and TA = +25°C.) (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNIT
DC CHARACTERISTICS
Supply Voltage
VCCA
Relative to GNDA
3.0
5.5
V
VCCB
Relative to GNDB
3.0
5.5
Supply Current
ICCA,
ICCB
Unidirectional inputs
at DC or 2Mbps;
bidirectional inputs at DC
or switching at 2Mbps,
no load
VCCA = +5V,
VCCB = +5V
7.2
11
mA
VCCA = +3.3V,
VCCB = +3.3V
6.2
9.5
All inputs switching at
max data rate. No load.
(Note 3)
VCCA
= +5V,
VCCB =
+5V
TA =
+25°C
15
22
TA =
+125°C
17
24
VCCA =
+3.3V,
VCCB =
+3.3V
TA =
+25°C
10
16
TA =
+125°C
11
18
Undervoltage-Lockout
Threshold
VUVLO
VCCA - VGNDA, VCCB - VGNDB (Note 4)
2
V
Undervoltage-Lockout
Hysteresis
VUVLOHYS
VCCA - VGNDA, VCCB - VGNDB (Note 4)
0.1
V


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