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GS1661 Datasheet(PDF) 82 Page - Semtech Corporation |
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GS1661 Datasheet(HTML) 82 Page - Semtech Corporation |
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82 / 84 page  GS1661 HD/SD SDI Receiver Data Sheet 53751 - 3 September 2012 82 of 84 7.2 Packaging Data 7.3 Marking Diagram Table 7-1: Packaging Data Parameter Value Package Type 11mm x 11mm 100-ball LBGA Package Drawing Reference JEDEC M0192 (with exceptions noted in Package Dimensions on page 81). Moisture Sensitivity Level 3 Junction to Case Thermal Resistance, θj-c 15.4°C/W Junction to Air Thermal Resistance, θj-a (at zero airflow) 37.1°C/W Junction to Board Thermal Resistance, θj-b 26.4°C/W Psi, ψ 0.4°C/W Pb-free and RoHS Compliant Yes GS1661 XXXXE3 YYWW Pin 1 ID XXXX - Last 4 digits (excluding decimal) of SAP Batch Assembly (FIN) as listed on Packing Slip. E3 - Pb-free & Green indicator YYWW - Date Code |
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