Published by Infineon Technologies AG

Pr oduct Brief

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http://www.infineon.com

Published by

Infineon Technologies AG,

St.-Martin-Strasse 53,

D-81669 München

© Infineon Technologies AG 2004.

All Rights Reserved.

Template: pb_tmplt.fm/4/2004-01-01

Attention please!

The information herein is given to describe certain components

and shall not be considered as a guarantee of characteristics.

Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not

limited to warranties of non-infringement, regarding circuits,

descriptions and charts stated herein.

Information

For further information on technology, delivery terms

and conditions and prices please contact your nearest

Infineon Technologies Office.

Warnings

Due to technical requirements components may contain dangerous

substances. For information on the types in question please contact

your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-

support devices or systems with the express written approval of

Infineon Technologies, if a failure of such components can reason-

ably be expected to cause the failure of that life-support device or

system, or to affect the safety or effectiveness of that device or sys-

tem. Life support devices or systems are intended to be implanted

in the human body, or to support and/or maintain and sustain

and/or protect human life. If they fail, it is reasonable to assume

that the health of the user or other persons may be endangered.

Bloc k Diagr a m of C B ME V1.1 w i th As soc i at ed V M I

Layer 1 Control Processor

L1 Application Software

Downlink

Antenna

CGU

Downlink

CGU

Uplink

CGU

PDE

CBME

Tx

Tx

Finger 2

Finger 3

Finger 1

Finger N

Searcher

Combiner

DSM

Virtual Machine Interface Library

Memory Mapped Peripheral

microDSP Array

Finger

Processing

3G Basestation Processor 64

Soft

Symbols

Interleaved

Symbols

From

Antennas

To

Antennas

Searcher

Processing

Preamble

Processing

Transmit

Processing

Ordering No. B134-H8387-X-0-7600

Printed in Germany

PS 0204.5

NB

Fea t u r es

■

Channel capacity maintained across:

–Spreading factors

– Compressed-mode operation

■

Very low latency power control loop

■

Pooled resources across antennas and sectors

■

Supports N-antenna Rx and Tx diversity

■

HSDPA ready

Developme n t T o ols

■

VMI functional simulator

■

microDSP development toolkit

■

Hardware development platform

O r derin g Inf o rm ation

Please contact Infineon Technologies Morphics, or your

local Infineon sales office for additional information about

our 3G basestation products