2003-01-17

Page 2

IPD06N03L

Thermal Characteristics

Parameter

Symbol

Values

Unit

min.

typ.

max.

Characteristics

Thermal resistance, junction - case

-

0.7

1

K/W

Thermal resistance, junction - ambient, leaded

-

-

100

SMD version, device on PCB:

@ min. footprint

-

-

-

-

75

50

Parameter

Symbol

Values

Unit

min.

typ.

max.

Static Characteristics

Drain-source breakdown voltage

30

-

-

V

1.2

1.6

2

Zero gate voltage drain current

-

-

0.01

10

1

100

µA

Gate-source leakage current

-

1

100

nA

Drain-source on-state resistance

-

6.8

8.7

m

Ω

Drain-source on-state resistance

-

4.7

5.9

1Current limited by bondwire ; with an R

information see app.-note ANPS071E available at www.infineon.com/optimos

2Defined by design. Not subject to production test.

3Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain

connection. PCB is vertical without blown air.