2.5 mm x 3.2 mm Ceramic Package SMD Oscillator

ISM87 Series

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●

www.ilsiamerica.com

Specifications subject to change without notice

Rev: 11/29/14_A

Page 2 of 2

Pb Free Solder Reflow Profile:

Typical Application:

*Units are backward compatible with 240º C reflow processes

Package Information:

MSL = N.A. (Package does not contain plastic; storage life is unlimited under normal room conditions.)

Termination = e4 (Au over Ni over W base metallization).

Tape and Reel Information:

Quantity per

Reel

1000

A

8.0 +/-.2

B

4.0 +/-.2

C

5.5 +/-.1

D

9.0 +/-1

E

50 / 60 / 80

F

180

Environmental Specifications:

Thermal Shock

MIL-STD-883, Method 1011, Condition A

Moisture Resistance

MIL-STD-883, Method 1004

Mechanical Shock

MIL-STD-883, Method 2002, Condition B

Mechanical Vibration

MIL-STD-883, Method 2007, Condition A

Resistance to Soldering Heat

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Hazardous Substance

Pb-Free / RoHS / Green Compliant

Solderability

JESD22-B102-D Method 2 (Preconditioning E)

Terminal Strength

MIL-STD-883, Method 2004, Test Condition D

Gross Leak

MIL-STD-883, Method 1014, Condition C

Fine Leak

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

Solvent Resistance

MIL-STD-202, Method 215

Marking:

Line 1: ILSI and Date Code (YWW)

Line 2: Frequency

Proprietary and Confidential

This document contains proprietary information, and such information may not be disclosed to others for any purpose nor

used for manufacturing purpose without the written permission of ILSI America.