3.2 mm x 5.0 mm Ceramic Package SMD Oscillator

ISM82 Series

ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●

www.ilsiamerica.com

Specifications subject to change without notice

Rev: 10/20/14_A3

Page 2 of 2

Pb Free Solder Reflow Profile:

Typical Application:

*Units are backward compatible with 240º C reflow processes

Package Information:

MSL = N.A. (Package does not contain plastic; storage life is unlimited under normal room conditions.)

Termination = e4 (Au over Ni over W base metallization).

Tape and Reel Information:

Quantity per

Reel

1000

A

16 +/-.3

B

8 +/-.2

C

7.5 +/-.2

D

17.5 +/-1

E

50 / 60 / 80

F

180 / 250

Environmental Specifications:

Thermal Shock

MIL-STD-883, Method 1011, Condition A

Moisture Resistance

MIL-STD-883, Method 1004

Mechanical Shock

MIL-STD-883, Method 2002, Condition B

Mechanical Vibration

MIL-STD-883, Method 2007, Condition A

Resistance to Soldering Heat

J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)

Hazardous Substance

Pb-Free / RoHS / Green Compliant

Solderability

JESD22-B102-D Method 2 (Preconditioning E)

Terminal Strength

MIL-STD-883, Method 2004, Test Condition D

Gross Leak

MIL-STD-883, Method 1014, Condition C

Fine Leak

MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s

Solvent Resistance

MIL-STD-202, Method 215

Marking:

Line 1: ILSI and Date Code (YWW)

Line 2: Frequency

Proprietary and Confidential

This document contains proprietary information, and such information may not be disclosed to others for any purpose nor used for

manufacturing purpose without the written permission o ILSI America.