ISO7220A, ISO7220B, ISO7220C, ISO7220M

ISO7221A, ISO7221B, ISO7221C, ISO7221M

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SLLS755N – JULY 2006 – REVISED SEPTEMBER 2015

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

ISO722xA, ISO722xB, ISO722xM

3

5.5

V

ISO722xC

2.8

5.5

High-level output current

–4

mA

Low-level output current

4

mA

ISO722xA

1

0.67

μs

ISO722xB

200

100

ISO722xC

40

33

ns

ISO722xM

6.67

5

ISO722xA

0

1500

1000

kbps

ISO722xB

0

10

5

ISO722xC

0

30

25

Mbps

ISO722xM

0

200

150

High-level input voltage

2

5.5

V

ISO722xA, ISO722xB, ISO722xC

Low-level input voltage

0

0.8

V

High-level input voltage

V

ISO722xM

Low-level input voltage

0

V

Junction temperature

–40

150

°C

H

External magnetic field-strength immunity per IEC 61000-4-8 and IEC 61000-4-9 certification

1000

A/m

(1)

(2)

Typical signaling rate and Input pulse width are measured at ideal conditions at 25°C.

6.4 Thermal Information

ISO7220x

ISO7221x

UNIT

D (SOIC)

8 PINS

212

Junction-to-ambient thermal resistance

°C/W

High-K Thermal Resistance

122

Junction-to-case (top) thermal resistance

69.1

°C/W

Junction-to-board thermal resistance

47.7

°C/W

Junction-to-top characterization parameter

15.2

°C/W

Junction-to-board characterization parameter

47.2

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

(2)

Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages.

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