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TUSB4041I-Q1 Datasheet(PDF) 34 Page - Texas Instruments |
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TUSB4041I-Q1 Datasheet(HTML) 34 Page - Texas Instruments |
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34 / 44 page  34 TUSB4041I-Q1 SLLSEK4B – JULY 2015 – REVISED JANUARY 2016 www.ti.com Product Folder Links: TUSB4041I-Q1 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated 10 Power Supply Recommendations 10.1 TUSB4041I-Q1 Power Supply The user should implement VDD as a single power plane, as well as VDD33. • The VDD pins of the TUSB4041I-Q1 supply 1.1-V (nominal) power to the core of the TUSB4041I-Q1 device. This power rail can be isolated from all other power rails by a ferrite bead to reduce noise. • The DC resistance of the ferrite bead on the core power rail can affect the voltage provided to the device because of the high current draw on the power rail. The user may need to adjust the output of the core voltage regulator to account for this, or select a ferrite bead with low DC resistance (less than 0.05 Ω). • The VDD33 pins of the TUSB4041I-Q1 device supply 3.3-V power rail to the I/O of the TUSB4041I-Q1 device. This power rail can be isolated from all other power rails by a ferrite bead to reduce noise. • All power rails require a 10-µF capacitor or 1-µF capacitors for stability and noise immunity. These bulk capacitors can be placed anywhere on the power rail. Place the smaller decoupling capacitors as close to the TUSB4041I-Q1 power pins as possible with an optimal grouping of two capacitors of differing values per pin. 10.2 Downstream Port Power • A source capable of supplying 5 V and up to 500 mA per port must supply the downstream port power, VBUS. The TUSB4041I-Q1 signals can control the downstream port power switches. Leaving the downstream port power as always enabled is also possible. • The VBUS of each downstream port requires a large-bulk low-ESR capacitor of 22 µF or larger to limit in-rush current. • TI recommends the ferrite beads on the VBUS pins of the downstream USB port connections for both ESD and EMI reasons. A 0.1-µF capacitor on the USB connector side of the ferrite provides a low-impedance path to ground for fast rise time ESD current that might have coupled onto the VBUS trace from the cable. 10.3 Ground TI recommends to use only one board ground plane in the design which provides the best image plane for signal traces running above the plane. Connect the thermal pad of the TUSB4041I-Q1 and any of the voltage regulators to this plane with vias. An earth or chassis ground is implemented only near the USB port connectors on a different plane for EMI and ESD purposes. |
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