6

LMH0356

SNLS270L – AUGUST 2007 – REVISED JANUARY 2016

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Copyright © 2007–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

4

v

Logic supply voltage

V

Logic input current (single input)

–5

mA

5

Logic output voltage

V

Logic output source/sink current

–8

8

mA

Serial data output sink current

24

mA

125

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 500-V HBM is possible with the necessary precautions. Pins listed as ±8000 V may actually have higher performance.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with

less than 250-V CDM is possible with the necessary precautions. Pins listed as ±1250 V may actually have higher performance.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±8000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1250

Machine model (MM)

±400

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

3.3 – 5%

3.3 + 5%

V

Logic input voltage

V

Differential serial input voltage

800 – 10%

800 + 10%

mV

Serial data or clock output sink current

16

mA

Operating free-air temperature

–40

85

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

7.4 Thermal Information

LMH0356

UNIT

RHS (WQFN)

RSB (WQFN)

48 PINS

40 PINS

Junction-to-ambient thermal resistance

28.3

31.2

°C/W

Junction-to-case (top) thermal resistance

8.8

16.8

°C/W

Junction-to-case (bottom) thermal resistance

1.3

1.2

°C/W