LM555

SNAS548D – FEBRUARY 2000 – REVISED JANUARY 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

1180

mW

LM555CMM

613

mW

PDIP Package

Soldering (10 Seconds)

260

°C

Soldering

Vapor Phase (60 Seconds)

215

°C

Small Outline Packages (SOIC and

Information

VSSOP)

Infrared (15 Seconds)

220

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

(3)

For operating at elevated temperatures the device must be derated above 25°C based on a 150°C maximum junction temperature and a

thermal resistance of 106°C/W (PDIP), 170°C/W (S0IC-8), and 204°C/W (VSSOP) junction to ambient.

(4)

Refer to RETS555X drawing of military LM555H and LM555J versions for specifications.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

The ESD information listed is for the SOIC package.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply Voltage

18

V

0

70

°C

70

°C

6.4 Thermal Information

LM555

PDIP

SOIC

VSSOP

UNIT

8 PINS

Junction-to-ambient thermal resistance

106

170

204

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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