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CDCM6208V1FRGZR Datasheet(PDF) 8 Page - Texas Instruments |
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CDCM6208V1FRGZR Datasheet(HTML) 8 Page - Texas Instruments |
8 / 87 page ![]() CDCM6208V1F SCAS943 – MAY 2015 www.ti.com 8.5 Thermal Information, Airflow = 150 LFM (1) (2) (3) (4) CDCM6208 THERMAL METRIC(1) RGZ UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 21.8 RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance 6.61 °C/W ψJT Junction-to-top characterization parameter 0.37 ψJB Junction-to-board characterization parameter RθJC(bot) Junction-to-case (bottom) thermal resistance 1.06 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board). (3) Connected to GND with 36 thermal vias (0.3 mm diameter). (4) θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN. 8.6 Thermal Information, Airflow = 250 LFM (1) (2) (3) (4) CDCM6208 THERMAL METRIC(1) RGZ UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 19.5 RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance 6.6 °C/W ψJT Junction-to-top characterization parameter 0.45 ψJB Junction-to-board characterization parameter RθJC(bot) Junction-to-case (bottom) thermal resistance 1.06 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board). (3) Connected to GND with 36 thermal vias (0.3 mm diameter). (4) θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN. 8.7 Thermal Information, Airflow = 500 LFM (1) (2) (3) (4) CDCM6208 THERMAL METRIC(1) RGZ UNIT 48 PINS RθJA Junction-to-ambient thermal resistance 17.7 RθJC(top) Junction-to-case (top) thermal resistance RθJB Junction-to-board thermal resistance 6.58 °C/W ψJT Junction-to-top characterization parameter 0.58 ψJB Junction-to-board characterization parameter RθJC(bot) Junction-to-case (bottom) thermal resistance 1.05 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board). (3) Connected to GND with 36 thermal vias (0.3 mm diameter). (4) θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN. 8 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: CDCM6208V1F |
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