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CDCM6208V1FRGZR Datasheet(PDF) 74 Page - Texas Instruments |
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CDCM6208V1FRGZR Datasheet(HTML) 74 Page - Texas Instruments |
74 / 87 page ![]() CDCM6208V1F SCAS943 – MAY 2015 www.ti.com 13 Layout 13.1 Layout Guidelines Employing the thermally enhanced printed circuit board layout shown in Figure 59 insures good thermal performance of the solution. Observing good thermal layout practices enables the thermal pad on the backside of the QFN-48 package to provide a good thermal path between the die contained within the package and the ambient air. This thermal pad also serves as the ground connection the device; therefore, a low inductance connection to the ground plane is essential. 13.2 Layout Example Figure 59 shows a layout optimized for good thermal performance and a good power supply connection as well. The 7×7 filled via pattern facilitates both considerations. Figure 59. Recommended PCB layout of CDCM6208 74 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: CDCM6208V1F |
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