CDCM6208V1FRGZR datasheet(7/87 Pages) TI1

Part #	CDCM6208V1FRGZR

Description	2:8 Clock Generator, Jitter Cleaner with Fractional Dividers

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Manufacturer	TI1 [Texas Instruments]

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CDCM6208V1F

www.ti.com

SCAS943 – MAY 2015

8.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VDD_Yx_Yy

Output Supply Voltage

1.71

1.8/2.5/3.3

3.465

V

VDD_PLL1

Core Analog Supply Voltage

1.71

1.8/2.5/3.3

3.465

V

VDD_PLL2

DVDD

Core Digital Supply Voltage

1.71

1.8/2.5/3.3

3.465

V

VDD_PRI,

Reference Input Supply Voltage

1.71

1.8/2.5/3.3

3.465

V

VDD_SEC

VDD power-up ramp time (0 to 3.3 V) PDN left open, all VDD tight

ΔVDD/Δt

50 < tPDN

ms

together PDN low-high is delayed (1)

TA

Ambient Temperature

-40

85

°C

SDA and SCL in I 2 C MODE (SI_MODE[1:0] = 01)

DVDD = 1.8 V

–0.5

2.45

V

VI

Input Voltage

DVDD = 3.3 V

–0.5

3.965

V

100

dR

Data Rate

kbps

400

0.7 x

VIH

High-level input voltage

V

DVDD

VIL

Low-level input voltage

0.3 x DVDD

V

CBUS_I2C

Total capacitive load for each bus line

400

pF

(1)

For fast power up ramps under 50 ms and when all supply pins are driven from the same power supply source, PDN can be left floating.

For slower power up ramps or if supply pins are sequenced with uncertain time delays, PDN needs to be held low until DVDD,

VDD_PLLx, and VDD_PRI/SEC reach at least 1.45V supply voltage. See application section on mixing power supplies and particularly

Figure 58 for details.

8.4 Thermal Information, Airflow = 0 LFM

(1) (2) (3) (4)

CDCM6208

THERMAL METRIC(1)

RGZ

UNIT

48 PINS VQFN

RθJA

Junction-to-ambient thermal resistance

30.27

RθJC(top)

Junction-to-case (top) thermal resistance

16.58

RθJB

Junction-to-board thermal resistance

6.83

°C/W

ψJT

Junction-to-top characterization parameter

0.23

ψJB

Junction-to-board characterization parameter

6.8

RθJC(bot)

Junction-to-case (bottom) thermal resistance

1.06

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The package thermal resistance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board).

(3)

Connected to GND with 36 thermal vias (0.3 mm diameter).

(4)

θJB (junction to board) is used for the QFN package, the main heat flow is from the junction to the GND pad of the QFN.

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