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TPA3131D2 Datasheet(PDF) 16 Page - Texas Instruments

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Part # TPA3131D2
Description  25-W Filter-Free Class-D Stereo Amplifier
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPA3131D2 Datasheet(HTML) 16 Page - Texas Instruments

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8
GAIN/SLV
GVDD
INPL
INNL
MUTE
GND
PLIMIT
AM2
GND
1µF
1µF
1µF
1µF
GND
1µF
/FAULTZ
IN_P_RIGHT
IN_N_RIGHT
IN_N_LEFT
IN_P_LEFT
MUTE
100k
100k
100k
> 1.4sec
mP
TPA3131/32D2
SDZ
MUTE
FAULTZ
SDZ
MUTE
FAULTZ
TPA3131D2, TPA3132D2
SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015
www.ti.com
The minimum output offset voltages required to trigger the DC detect are show in Table 5. The outputs must
remain at or above the voltage listed in the table for more than 420 msec to trigger the DC detect.
Table 5. DC Detect Threshold
PVCC (V)
VOS - OUTPUT OFFSET VOLTAGE (V)
4.5
0.96
6
1.3
12
2.6
18
3.9
7.3.10 Short-Circuit Protection and Automatic Recovery Feature
The TPA313xD2 has protection from over current conditions caused by a short circuit on the output stage. The
short circuit protection fault is reported on the FAULTZ pin as a low state. The amplifier outputs are switched to a
high impedance state when the short circuit protection latch is engaged. The latch can be cleared by cycling the
SDZ pin through the low state.
If automatic recovery from the short circuit protection latch is desired, connect the FAULTZ pin directly to the
SDZ pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the short-
circuit protection latch.
In systems where a possibility of a permanent short from the output to PVDD or to a high voltage battery like a
car battery can occur, pull the MUTE pin low with the FAULTZ signal with a inverting transistor to ensure a high-
Z restart, like shown in the figure below:
Figure 24. MUTE Driven by Inverted FAULTZ
Figure 25. Timing Requirement for SDZ
7.3.11 Thermal Protection
Thermal protection on the TPA313xD2 prevents damage to the device when the internal die temperature
exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature
exceeds the thermal trip point, the device enters into the shutdown state and the outputs are disabled. This is a
latched fault.
Thermal protection faults are reported on the FAULTZ terminal as a low state.
If automatic recovery from the thermal protection latch is desired, connect the FAULTZ pin directly to the SDZ
pin. This allows the FAULTZ pin function to automatically drive the SDZ pin low which clears the thermal
protection latch.
16
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