TPA3131D2, TPA3132D2

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SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

–0.3

30

V

INPL, INNL, INPR, INNR

–0.3

6.3

V

PLIMIT, GAIN / SLV, SYNC

–0.3

GVDD+0.3

V

AM0, AM1, AM2, MUTE, SDZ

–0.3

PVCC+0.3

V

Slew rate, maximum

AM0, AM1, AM2, MUTE, SDZ

10

V/ms

–40

85

°C

–40

150

°C

–40

125

°C

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

4.5

26

V

High-level input

AM0, AM1, AM2, MUTE, SDZ, SYNC

2

V

voltage

Low-level input

AM0, AM1, AM2, MUTE, SDZ, SYNC

0.8

V

voltage

Low-level output

0.8

V

voltage

High-level input

50

µA

current

Output filter: L = 10 µH, C = 680 nF

3.2

4

Minimum load

Ω

Impedance

Output filter: L = 10 µH, C = 1 µF

1.6

Output-filter

Minimum output filter inductance under short-circuit condition

1

µH

Inductance

6.4 Thermal Information

TPA313xD2

VQFN

UNIT

32 PINS

Junction-to-ambient thermal resistance

31.3

Junction-to-top characterization parameter

0.2

°C/W

Junction-to-board characterization parameter

5.5

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

The heat sink drawing used for the thermal model data are shown in the application section, size: 14mm wide, 50mm long, 25mm high.

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