TPA3131D2, TPA3132D2

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SLOS841B – SEPTEMBER 2013 – REVISED JANUARY 2015

Layout Example (continued)

Figure 33. Layout Example Bottom

10.3 Thermal Design

Main thermal path for cooling the device is from the bottom side PowerPAD through multiple via connections in

the PCB to the bottom side ground plane. The high power efficiency allows TPA3131D2 to be operated

continuously at rated output power into both 4-

Ω and 8-Ω load, and TPA3132D2 into 8-Ω load using a PCB

layout similar to what is used in the TPA3131D2/32D2 EVMs. The rated output power of TPA3132D2 into 4-

Ω

load will be available only for a limited duration of time when using a PCB layout similar to the EVM layout.

Sustained power output into 4

Ω needs to be limited to prevent excess heating of the device. TPA3132D2 will be

able to output full output power for a limited duration of time. The duration depends on the actual PCB layout. For

the TPA3132D2 EVM layout the TPA3132D2 full output power with 4-

Ω load can be illustrated with a burst test at

room temp (25°C):

Table 7. TPA3132D2 EVM Burst Output Power

BURST

REDUCED POWER 1kHz

MAXIMUM DEVICE

PCB TEMPERATURE

FULL POWER 1kHz

RATIO

(1/8 of full power)

TEMPERATURE

(Bottom Side, Under Device)

1:3

1 Cycle 44 W / 4

Ω

2 Cycles 5.25 W / 4

Ω

116°C

85°C

2:5

2 Cycles 44 W / 4

Ω

3 Cycles 5.25 W / 4

Ω

143°C

102°C

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