MODSEL

SD

FAULT

INPR

INNR

PLIMIT

GVDD

GAIN/SLV

GND

INPL

INNL

MUTE

AM2

AM1

AM0

SYNC

PVCC

PVCC

BSPR

OUTPR

GND

OUTNR

BSNR

GND

BSPL

OUTPL

GND

OUTNL

BSNL

PVCC

PVCC

AVCC

GVDD

GVDD

GVDD

MUTE

100K

TPA3116D2-Q1

FAULT

SD

100K

1uF

100K

100K

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

23

22

21

20

19

18

17

32

31

30

29

28

27

26

25

24

TPA3116D2-Q1, TPA3118D2-Q1

www.ti.com

SLOS862A – JULY 2015 – REVISED AUGUST 2015

Figure 15. MUTE Driven by Inverted FAULT

7.3.11 Thermal Protection

Thermal protection on the TPA311xD2-Q1 family prevents damage to the device when the internal die

temperature exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die

temperature exceeds the thermal trip point, the device enters the shutdown state and the outputs are disabled.

This is a latched fault.

Thermal protection faults are reported on the FAULT pin as a low state.

If automatic recovery from the thermal protection latch is desired, connect the FAULT pin directly to the SD pin.

This allows the FAULT pin function to automatically drive the SD pin low, which clears the thermal protection

latch.

7.3.12 TPA311xD2-Q1 Modulation Scheme

The TPA311xD2-Q1 family has the option of running in either BD modulation or 1SPW modulation; this is set by

the MODSEL pin.

7.3.12.1 MODSEL = GND: BD Modulation

Each output is switching from 0 volts to the supply voltage. The OUTPx and OUTNx are in phase with each other

with no input so that there is little or no current in the speaker. The duty cycle of OUTPx is greater than 50% and

OUTNx is less than 50% for positive output voltages. The duty cycle of OUTPx is less than 50% and OUTNx is

greater than 50% for negative output voltages. The voltage across the load sits at 0 V throughout most of the

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Product Folder Links: TPA3116D2-Q1 TPA3118D2-Q1