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TPA3118D2-Q1 Datasheet(PDF) 22 Page - Texas Instruments |
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TPA3118D2-Q1 Datasheet(HTML) 22 Page - Texas Instruments |
22 / 36 page Output Power (W) 0.001 0.01 0.1 1 10 10m 100m 1 10 40 D005 20 Hz 1 kHz 6 kHz Output Power (W) 0.001 0.01 0.1 1 10 10m 100m 1 10 40 D006 20 Hz 1 kHz 6 kHz TPA3116D2-Q1, TPA3118D2-Q1 SLOS862A – JULY 2015 – REVISED AUGUST 2015 www.ti.com 8.2.3 Application Curves Gain = 26 dB PVCC = 12 V TA = 25°C Gain = 26 dB PVCC = 14.4 V TA = 25°C RL = 4 Ω 10-µH + 0.68-µF filter RL = 4 Ω 10-µH + 0.68-µF filte Figure 20. Total Harmonic Distortion + Noise (BTL) vs Figure 21. Total Harmonic Distortion + Noise (BTL) vs Output Power Output Power 9 Power Supply Recommendations The power supply requirements for the TPA3116D2-Q1 consist of one higher-voltage supply to power the output stage of the speaker amplifier. Several on-chip regulators are included on the TPA3116D2-Q1 to generate the voltages necessary for the internal circuitry of the audio path. It is important to note that the voltage regulators which have been integrated are sized only to provide the current necessary to power the internal circuitry. The external pins are provided only as a connection point for off-chip bypass capacitors to filter the supply. Connecting external circuitry to these regulator outputs may result in reduced performance and damage to the device. The high-voltage supply, between 4.5 V and 26 V, supplies the analog circuitry (AVCC) and the power stage (PVCC). The AVCC supply feeds the internal LDOs, including GVDD. The LDO outputs are connected to external pins for filtering purposes, but should not be connected to external circuits. The GVDD LDO output has been sized to provide current necessary for internal functions but not for external loading. 10 Layout 10.1 Layout Guidelines Because the class-D switching edges are fast, it is necessary to take care when planning the layout of the printed circuit board. The following suggestions help to meet EMC requirements. • Decoupling capacitors — The high-frequency decoupling capacitors should be placed as close to the PVCC and AVCC terminals as possible. Large (100 μF or greater) bulk power supply decoupling capacitors should be placed near the TPA3116D2-Q1 on the PVCC supplies. Local, high-frequency bypass capacitors should be placed as close to the PVCC pins as possible. These capacitors can be connected to the IC GND pad directly for an excellent ground connection. Consider adding a small, good-quality, low-ESR ceramic capacitor between 220 pF and 1 nF and a larger mid-frequency capacitor of value between 100 nF and 1 µF, also of good quality, to the PVCC connections at each end of the chip. • Keep the current loop from each of the outputs through the filter and back to GND as small and tight as possible. The size of this current loop determines its effectiveness as an antenna. • Grounding — The PVCC decoupling capacitors should connect to GND. All ground should be connected at the IC GND, which should be used as a central ground connection or star ground for the TPA3116D2-Q1. • Output filter — The LC filter should be placed close to the outputs. The capacitor used in the LC filter should be grounded. 22 Submit Documentation Feedback Copyright © 2015, Texas Instruments Incorporated Product Folder Links: TPA3116D2-Q1 TPA3118D2-Q1 |
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