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TPA3118D2-Q1 Datasheet(PDF) 22 Page - Texas Instruments

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Part # TPA3118D2-Q1
Description  100-W and 50-W Class-D Stereo Automotive Amplifiers
Download  36 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TPA3118D2-Q1 Datasheet(HTML) 22 Page - Texas Instruments

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Output Power (W)
0.001
0.01
0.1
1
10
10m
100m
1
10
40
D005
20 Hz
1 kHz
6 kHz
Output Power (W)
0.001
0.01
0.1
1
10
10m
100m
1
10
40
D006
20 Hz
1 kHz
6 kHz
TPA3116D2-Q1, TPA3118D2-Q1
SLOS862A – JULY 2015 – REVISED AUGUST 2015
www.ti.com
8.2.3 Application Curves
Gain = 26 dB
PVCC = 12 V
TA = 25°C
Gain = 26 dB
PVCC = 14.4 V
TA = 25°C
RL = 4 Ω
10-µH + 0.68-µF filter
RL = 4 Ω
10-µH + 0.68-µF filte
Figure 20. Total Harmonic Distortion + Noise (BTL) vs
Figure 21. Total Harmonic Distortion + Noise (BTL) vs
Output Power
Output Power
9 Power Supply Recommendations
The power supply requirements for the TPA3116D2-Q1 consist of one higher-voltage supply to power the output
stage of the speaker amplifier. Several on-chip regulators are included on the TPA3116D2-Q1 to generate the
voltages necessary for the internal circuitry of the audio path. It is important to note that the voltage regulators
which have been integrated are sized only to provide the current necessary to power the internal circuitry. The
external pins are provided only as a connection point for off-chip bypass capacitors to filter the supply.
Connecting external circuitry to these regulator outputs may result in reduced performance and damage to the
device. The high-voltage supply, between 4.5 V and 26 V, supplies the analog circuitry (AVCC) and the power
stage (PVCC). The AVCC supply feeds the internal LDOs, including GVDD. The LDO outputs are connected to
external pins for filtering purposes, but should not be connected to external circuits. The GVDD LDO output has
been sized to provide current necessary for internal functions but not for external loading.
10 Layout
10.1 Layout Guidelines
Because the class-D switching edges are fast, it is necessary to take care when planning the layout of the
printed circuit board. The following suggestions help to meet EMC requirements.
Decoupling capacitors — The high-frequency decoupling capacitors should be placed as close to the PVCC
and AVCC terminals as possible. Large (100
μF or greater) bulk power supply decoupling capacitors should
be placed near the TPA3116D2-Q1 on the PVCC supplies. Local, high-frequency bypass capacitors should
be placed as close to the PVCC pins as possible. These capacitors can be connected to the IC GND pad
directly for an excellent ground connection. Consider adding a small, good-quality, low-ESR ceramic capacitor
between 220 pF and 1 nF and a larger mid-frequency capacitor of value between 100 nF and 1 µF, also of
good quality, to the PVCC connections at each end of the chip.
Keep the current loop from each of the outputs through the filter and back to GND as small and tight as
possible. The size of this current loop determines its effectiveness as an antenna.
Grounding — The PVCC decoupling capacitors should connect to GND. All ground should be connected at
the IC GND, which should be used as a central ground connection or star ground for the TPA3116D2-Q1.
Output filter — The LC filter should be placed close to the outputs. The capacitor used in the LC filter should
be grounded.
22
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