PCM2903C

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SBFS038A – JUNE 2012 – REVISED SEPTEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted).

(1)

MIN

MAX

UNIT

–0.3

4

V

±0.1

V

Ground voltage differences, AGNDC, AGNDP, AGNDX, DGND, DGNDU

±0.1

V

SEL0, SEL1, DIN

–0.3

6.5

V

Digital input

voltage

D+, D–, HID0, HID1, HID2, XTI, XTO, DOUT, SSPND

–0.3

V

–0.3

V

Input current (any pins except supplies)

±10

mA

Ambient temperature under bias

–40

125

°C

150

°C

Lead temperature (soldering, 5 s)

260

°C

Package temperature (IR reflow, peak)

250

°C

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

3

3.3

3.6

V

Supply current

ADC, DAC operation

54

70

mA

USB suspend state

250

µA

Ambient temperature

0

25

85

°C

7.4 Thermal Information

PCM2903C

DB (SSOP)

UNIT

28 PINS

Junction-to-ambient thermal resistance

64.5

°C/W

Junction-to-case (top) thermal resistance

24.5

°C/W

Junction-to-board thermal resistance

25.4

°C/W

Junction-to-top characterization parameter

2.0

°C/W

Junction-to-board characterization parameter

25

°C/W

Junction-to-case (bottom) thermal resistance

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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