PACKAGE OPTION ADDENDUM

www.ti.com

24-Apr-2015

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

PGA2311P

ACTIVE

PDIP

N

16

25

Green (RoHS

& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

PGA2311P

PGA2311PA

ACTIVE

PDIP

N

16

25

Green (RoHS

& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

PGA2311P

A

PGA2311PAG4

ACTIVE

PDIP

N

16

25

Green (RoHS

& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

PGA2311P

A

PGA2311PG4

ACTIVE

PDIP

N

16

25

Green (RoHS

& no Sb/Br)

CU NIPDAU

N / A for Pkg Type

PGA2311P

PGA2311U

ACTIVE

SOIC

DW

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

PGA2311U

PGA2311U/1K

ACTIVE

SOIC

DW

16

1000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

PGA2311U

PGA2311U/1KG4

ACTIVE

SOIC

DW

16

1000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

PGA2311U

PGA2311UA

ACTIVE

SOIC

DW

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

PGA2311U

A

PGA2311UA/1K

ACTIVE

SOIC

DW

16

1000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

PGA2311U

A

PGA2311UAG4

ACTIVE

SOIC

DW

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

PGA2311U

A

PGA2311UG4

ACTIVE

SOIC

DW

16

40

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

-40 to 85

PGA2311U

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.