TLV1702-Q1, TLV1704-Q1

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SLOS890A – NOVEMBER 2015 – REVISED DECEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage

40 (±20)

V

V

Signal input pins

±10

mA

Continuous

mA

Operating temperature

–55

150

°C

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails must be

current limited to 10 mA or less.

(3)

Short-circuit to ground; one comparator per package.

7.2 ESD Ratings

VALUE

UNIT

±1000

Electrostatic discharge

V

Charged-device model (CDM), per AEC Q100-011

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

2.2 (±1.1)

36 (±18)

V

Specified temperature

–40

125

°C

7.4 Thermal Information

TLV1702-Q1

TLV1704-Q1

DGK (VSSOP)

PW (TSSOP)

UNIT

8 PINS

14 PINS

Junction-to-ambient thermal resistance

199

128.1

°C/W

Junction-to-case (top) thermal resistance

89.5

56.5

°C/W

Junction-to-board thermal resistance

120.4

69.9

°C/W

Junction-to-top characterization parameter

22

9.1

°C/W

Junction-to-board characterization parameter

118.7

69.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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