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LM119, LM219, LM319

SNOSBJ2B – AUGUST 2000 – REVISED JANUARY 2016

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Product Folder Links: LM119 LM219 LM319

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Copyright © 2000–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

Refer to RETS119X for LM119H/883 and LM119J/883 specifications.

(4)

For supply voltages less than ±15 V the absolute maximum input voltage is equal to the supply voltage.

(5)

The maximum junction temperature of the LM119 is 150°C, while that of the LM219 is 110°C. For operating at elevated temperatures,

devices in the H10 package must be derated based on a thermal resistance of 160°C/W, junction to ambient, or 19°C/W, junction to

case. The thermal resistance of the J14 and N14 packages is 100°C/W, junction to ambient.

(6)

See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.

5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

Total supply voltage

36

V

Output to negative supply voltage

36

V

Ground to negative supply voltage

25

V

Ground to positive supply voltage

18

V

Differential input voltage

–5

+5

V

–15

+15

V

500

mW

Output short circuit duration

10

sec

Lead temperature (soldering, 10 sec.)

260

°C

Dual-In-Line Package Soldering (10 seconds)

260

°C

Small Outline Package Vapor Phase (60

seconds)

215

Small Outline Package Infrared (15 seconds)

220

Operating temperature

LM119

–55

125

°C

LM219

–25

85

LM319A, LM319

0

70

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

5.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±800

V

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

5.3 Thermal Information

LM119, LM219, LM319

UNIT

TO-100

(LME)

PDIP

(NFF)

CDIP

(J)

10 PINS

14 PINS

14 PINS

Junction-to-ambient thermal resistance

160

100

100

°C/W

Junction-to-case (top) thermal resistance

19

NA

NA

°C/W