POWER DISCRETE

Data Sheet

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DS612A

Rev Date: 5-14

TSON8-FL

Process Highlights

• Bare copper leadframe with no plating

• Die attach: 55 um thin die pick up capability

• Interconnect: Cu clips technology for better electrical and thermal

performance. Also available on Al strap + wire option.

• Plating: 100% matte Sn

• Marking: Pen type laser

Standard Materials

• Leadframe: Bare copper

• Die attach: Solder paste*

• Interconnect: 2 option,

– Dual Cu clips

– Al strap + wire 2 mil Cu

• Mold compound: Halogen free

*Apply to option dual Cu clips.

Reliability Qualification

Amkor devices are assembled with proven reliable semiconductor materials.

• Alltestincludepre-conditionof:Ta=85°C/Rh=85%,72hrswithIRreflow

Ta = 265°C, 2X

• High Temperature Storage, Ta = 150°C, 1000 hrs

• Pressure Cooker, Ta = 121°C/Rh = 100%/P = 2 atm, 96 hrs

• Temperature Cycle, -65~150°C, 300 cycles

Test Service

Amkor offers full turnkey business for all power discrete products. We have

the capability to test various type of power devices including MOSFETs,

bipolar transistors, IGBTs, diodes, regulator ICs/intelligent power devices, etc.

• Amkor power discrete test capability:

– Static test (DC)

– Dynamic test (AC, Switching/Trr, Capacitance/Rg)

– Destruction test (Inductive load/VSUS, I Latch, Surge, Isolation/VIL)

– ThermalResistance(ΔVDS,ΔmV,etc.)

• Program generation/conversion

• Failure analysis

• Available test/handling technology

• Integrated marking, vision inspection and tape & reel services

Introduction

TSON8-FL (Flat Lead) is a smaller package (3.3 x 3.3 mm)

with thermally enhanced that gives a 64% reduction in

footprint area compared with standard SOIC 8 ld package,

yet an equivalent maximum permissible power dissipation

capability.

This package may also be know as:

• TSON-Adv

• PowerFLAT™ 3.3 x 3.3

• TSDSON

• miniHVSON

• JEDEC: MO240 BA

Application

TSON8-FL is suitable for medium-power applications,

designed for low on-resistance and high-speed-switching

MOSFETs:

• Battery protection circuits

• Notebook PCs

• Portable electronic devices

• DC-DC converters

Features

• Small and thermally enhanced package with the same

power dissipation but 64% less footprint area than

SOIC 8 ld

• Dual Cu Clip interconnect for better heat dissipation

efficiency

• Al strap + wire option is also available

• Turnkey with test and packing services

• Green materials: Pb-free plating & halogen free mold

compound

New Developments

• Dual exposed pad for better thermal performance

• Thin wafer dicing with narrow saw streets

• Larger/higher density leadframe strips

• Environmentally friendly Pb-free solder paste