POWER DISCRETE

Data Sheet

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DS614A

Rev Date: 5-14

SOD123-FL

Process Highlights

• Bare copper leadframe with no plating

• Interconnect: Cu clips technology for better electrical and thermal

performance

• Plating: 100% matte Sn

• Marking: Pen type laser

Standard Materials

• Leadframe: Bare copper

• Die attach: Solder paste

• Interconnect: Cu clips

• Mold compound: Halogen free

Reliability Qualification

Amkor devices are assembled with proven reliable semiconductor materials.

All test includes pre-condition of: Ta = 85°C/Rh = 85%, 24 hrs with IR reflow,

Ta = 260°C, 4X

• Temperature & Humidity Storage, Ta = 85°C/Rh = 85%, 2000 hrs

• High Temperature Storage, Ta = 150°C, 2000 hrs

• Pressure Cooker, Ta = 121°C/Rh = 100%/P = 2 atm, 500 hrs

• Temperature Cycle, -45~150°C, 1000 cycles

Test Service

Amkor offers full turnkey business for all power discrete products. We have

the capability to test various type of power devices including MOSFETs,

bipolar transistors, IGBTs, diodes, regulator ICs/intelligent power devices, etc.

• Amkor power discrete test capability:

– Static test (DC)

– Dynamic test (AC, Switching/Trr, Capacitance/Rg)

– Destruction test (Inductive load/VSUS, I Latch, Surge, Isolation/VIL)

– Thermal Resistance (ΔVDS, ΔmV, etc.)

• Program generation/conversion

• Failure analysis

• Available test/handling technology

• Integrated marking, vision inspection and tape & reel services

Introduction

The SOD123-FL package is part of the FLAT series

of compact surface mount packages which allow

communication equipment to be miniaturized. The Cu

clip structure of interconnect features reduces electrical

resistance and enhance thermal performance compared to

wire-bonded products.

This package may also be know as:

• S-FLAT

• SMF

• STmite Flat

• JEDEC: DO-219 AB

Application

The FLAT packages are suitable for the application of

high-efficiency diodes, in small & medium size:

• Schottky Barrier Diodes (SBDs)

• Rectifier Diodes

• Zener Diodes

Features

• Cu connector structure to reduce inductance and

resistance

• Enhance thermal property

• Turnkey with test and packing services

• Green materials: Pb-free plating & halogen-free mold

compound

New Developments

• Larger/higher density leadframe strips

• Environmentally friendly Pb-free solder paste